I36DUA Intel LGA1366 Solution
Excellent thermal performance and ultra silent 1.99.97% pure copper and heat pipe technology provides high thermal
 >> Home > NEWS > Aluminum extrusion heatsink provides massive heat dissipation-I75DUA-CLC


Aluminum extrusion heatsink provides massive heat dissipation

Comprehensive Cooling Solution: Cools CPU and the surrounding components
High Cooling Performance
- Easy installation design
- Super silent CPU cooler

Intel  LGA 775
Optimum Air Flow
Unique  fan cooling design ensures cool air accelerates straight through the heatsink


Radiate fin with copper core design provides excellent heat dissipation. Riveting the core copper touches the heat center directly, and conducts heat quickly.





Intel® Core™2 Extreme Processor

Intel® Core™2 Quad Processor

Intel® Core™2 Duo Desktop Processor

Intel® Pentium® D Processor

Intel® Pentium® Processor Extreme Edition

Intel® Pentium® Processor for Desktop

Intel® Pentium® 4 Processors

Intel® Pentium® 4 Processor Extreme Edition

Intel® Celeron® Processor Family



Click here for more information.


We guarantee our excellent raw material & high quality control, competitive price and complete service after sale.

We also guarantee excellent product quality, strong packing system, reasonable price and on-time shipments.


Thermalfly Technology devotes in researching and developing Heat Conducting Techniques, and successfully applies it to CPU coolers for various kinds of PCs, heat-dissipation system for close-type Chassis, and solutions for heat-accumulation that electronics encounter.

Copyright © 2020 ThermalFly Inc. All rights reserved
Add:8F.-2, No.77, Sec. 1, Sintai 5th Rd., Sijhih Dist., New Taipei City 22101, Taiwan (R.O.C.)
Tel:+886-2-6615-9926 / Fax:+886-2-6615-9927