Radial shaped heatsink design centralizes the airflow for massive heat dissipation. Special frameless fan provides excellent heat dissipation and silent operation.
Description
Socket Type
Intel LGA1156/ LGA1155 Socket
Cooler dimension
124 * 124 *50.5 mm
Fan Spec
Dimension
90 * 90 * 25 mm (R)
Bearing type
Two Ball bearing/ one ball one sleeve bearing/ EBR bearing
Rotational Speed
2000 rpm +10%/-5% (3Pin)
Acoustic level
23 dB(A)
Life
60000 hrs/ 50000 hrs/ 40,000 hrs
Airflow
23.1 CFM
Voltage
12 V DC
Thermal Interface Material
High performance thermal grease
Application
Intel® Core™ i5-650 Processor
Intel® Core™ i5-655K Processor
Intel® Core™ i5-660 Processor
Intel® Core™ i5-670 Processor
Intel® Core™ i5-680 Processor
Intel® Core™ i3 Desktop Processor Family_All series
Intel® Pentium® Processor G6950
Remark
According to customer’s system thermal and acoustic level requirement, ThermalFly can depends on request to make customization model.