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High thermal conduction and low noise design

1.99.97% pure copper heat sink conducts CPU more efficiently.
2.Heat pipe technology provides excellent thermal conduction.
3.Side blowing air flow design fits slim case environment easily.
4.80x80x18 mm axial fan with PWM circuitry design for silence demand.

Thermal and Mechanical specification:

Thermal Resistance 0.17/W
Thermal Interface Material GE Toshiba TIG825
Dimension L103x W71x H84 (mm)
Components specification:
Heat Sink
Producing Type Stacked and Insert fin
Material Copper - C1100
Back Plate SECC with EVA
Type of Fixing Screw Spring
Fan size 80x80x18 (mm)
Rated Voltage 12 (V)
Ampere 0.1~0.56 (A)
Fan speed range 1000~ 4200 rpm(PWM).
Maximum air flow rate 60.8 CFM
Maximum air static pressure 5.0mmH2O
Bearing type One ball one sleeve
Acoustic noise 18~44 dB(A)
Life time MTBF 40000 hrs

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Tel:+886-2-6615-9926 / Fax:+886-2-6615-9927